SFI manufacturing process is divided into ceramic manufacturing process and semiconductor packaging process, which are independently completed in the front-end process, and equipment can be shared in the back-end process. Each production process has an independent inspection control to strictly secure the product quality of each checkpoint. The electrical properties of finish products and appearance are fully inspected by automatic equipment, unique packaging process, and low-temperature sintering formula, so that the product can have unique e electrical properties, leading the industry.