| Type of surge | ESD | Surge | EFT | |||
|---|---|---|---|---|---|---|
| Application | STS | MLE | SEH | MLC | MLC | MLA |
| Standard | IEC61000-4-2 | IEC61000-4-5 | IEC61000-4-4 | |||
SFI has developed the STS series of overvoltage protectors dedicated to mobile phone communication. STS is a product using the newly developed SGD packaging method. It successfully encapsulates Wafer in the size of 0201~0603. It provides superior TVS product features and can effectively protect 15KV~25KV overvoltage. It has passed the international standard IEC61000-4-2. STS itself It has low voltage and low capacitance to provide better ESD protection for high-speed transmission such as USB 2.0, HDMI, and Thunderboat. In addition, STD uses SGD packaging to achieve ultra-low capacitance levels, and uses cutting-edge discharge methods to suppress ESD. STS/STD provides "same as RC products" packaging, which can reduce the verification process time, and has "excellent soldering properties". Compared to the drawbacks of using DFN in the market, which has always been difficult to solder and low flux, STS/STD is the best choice for mobile phone communication overvoltage components.
1.SMD package (0201~0603).
2.Specially designed for ESD protection of smartphones.
3.Low collapse pressure and high flow capacity.
4.High non-linear index α Reaching (above 99).
5.The response speed is faster than MLV (<0.1ns).
6.Passed IEC61000-4-2 testing.
7.Compliant with RoHS requirements and lead-free tin furnace.
8.Non polar bidirectional action.
1. Large size of plug-in packaging (5Å~14Å).
2.High suppression voltage (43V).
3.Large leakage current (<50μA).
4.Slow reaction speed (>100ns).
5.Severe deterioration phenomenon.
6.Failure modes may lead to combustion phenomena.
1.SMD DFN package is not easy to solder.
